Advanced Cooling Technologies for Microprocessors
نویسندگان
چکیده
Recent trends in processor power for the next generation devices point clearly to significant increase in processor heat dissipation over the coming years. In the desktop system design space, the tendency has been to minimize system enclosure size while maximizing performance, which in turn leads to high power densities in future generation systems. The current thermal solutions used today consist of advanced heat sink designs and heat pipe designs with forced air cooling to cool high power processors. However, these techniques are already reaching their limits to handle high heat flux, and there is a strong need for development of more efficient cooling systems which are scalable to handle the high heat flux generated by the future products. To meet this challenge, there has been research in academia and in industry to explore alternative methods for extracting heat from high-density power sources in electronic systems. This talk will discuss the issues surrounding device cooling, from the transistor level to the system level, and describe system-level solutions being developed for desktop computer applications developed in our group at Stanford University.
منابع مشابه
Thermal Management of Fujitsu’s High-Performance Servers
With the continued increase in power dissipation and power density of high-performance microprocessors, as well as requirements for high-density packaging and lower device junction temperatures, improvements of electronic cooling technologies have been becoming strategically important in the challenge of advanced thermal solutions for achieving higher cooling efficiencies while meeting reliabil...
متن کاملEffect of Using Nano Encapsulated Phase Change Material on Thermal Performance of Micro Heat Sink
The aim of this paper is to enhance thermal performance of a microchannel heat sink by using nanoencapsulated phase change material (NEPCM) slurry as a cooling fluid instead of pure fluid. A threedimensional model of a circular channel using water slurry of NEPCM was developed. The results show a significant reduction in the mean fluid temperature along the channel and heat sink wall temperatu...
متن کاملThermal Performance and Key Challenges for Future Cpu Cooling Technologies
Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and develo...
متن کاملThe Impact of Surface Area on the Radiative Thermal Behavior of Embedded Systems
A new global analytical model of the heat dissipation process that occurs in passively-cooled embedded systems is introduced, and we explicit under what circumstances the traditional assumption that exponential cooling laws apply in such context is valid. Since the power consumption and reliability of microprocessors are highly dependent on temperature, management units must be able to rely upo...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
عنوان ژورنال:
دوره شماره
صفحات -
تاریخ انتشار 2008